Evaluation of hydrogen and aluminum ion and low-temperature tolerance of various cereal crop cultivars

被引：0
|
作者：
N. M. Karmanenko
N. T. Nilovskaya
机构：
[1] Pryanishnikov All-Russian Agrochemistry Research Institute,
来源：
Russian Agricultural Sciences | 2010年 / 36卷 / 2期
关键词：
spring wheat; winter wheat; barley; rye; acidity of the medium; aluminum ions; low temperatures; tolerance;
D O I：
10.3103/S1068367410020035
中图分类号：
学科分类号：
摘要：
The effect of acidity of the medium, aluminum ions, and low temperatures on tolerance of plants to stresses is studied on seedlings of various cereal crops. It is shown that acid-and aluminum-tolerant spring and winter wheat and rye cultivars have tolerance to frosts and freezing. The degree of tolerance of the cultivar can be diagnosed from the reaction of plants to the effect of low temperatures.
引用
收藏
页码：86 / 89
页数：3
相关论文
共 50 条
  • [21] Low-Temperature Bonding of Silver to Aluminum
    Yasuda, Yusuke
    Terada, Shohei
    Morita, Toshiaki
    Kawaji, Hitoshi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2012, 51 (02)
  • [22] LOW-TEMPERATURE MAGNETOTHERMOELECTRIC POWER OF ALUMINUM
    AVERBACK, RS
    WAGNER, DK
    SOLID STATE COMMUNICATIONS, 1972, 11 (09) : 1109 - &
  • [23] ALUMINUM DEPOSITION ON LOW-TEMPERATURE GAAS
    KELLY, MK
    TACHE, N
    MARGARITONDO, G
    KAHN, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (03): : 882 - 883
  • [24] LOW-TEMPERATURE ELECTRICAL RESISTIVITY OF ALUMINUM
    SENOUSSI, S
    CAMPBELL, IA
    JOURNAL OF PHYSICS F-METAL PHYSICS, 1973, 3 (01): : L19 - L21
  • [25] LOW-TEMPERATURE ELASTIC MODULI OF ALUMINUM
    KAMM, GN
    ALERS, GA
    JOURNAL OF APPLIED PHYSICS, 1964, 35 (02) : 327 - &
  • [26] LOW-TEMPERATURE EMISSIVITIES OF COPPER AND ALUMINUM
    ESTALOTE, EA
    RAMANATHAN, KG
    JOURNAL OF THE OPTICAL SOCIETY OF AMERICA, 1977, 67 (01) : 39 - 44
  • [27] LOW-TEMPERATURE RECOVERY OF DEFORMED ALUMINUM
    SWANSON, ML
    CANADIAN JOURNAL OF PHYSICS, 1964, 42 (10) : 1890 - &
  • [28] FLUXLESS LOW-TEMPERATURE SOLDERING OF ALUMINUM
    KOLENKO, EA
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1991, 34 (05) : 1202 - 1202
  • [29] Low-Temperature Aluminum-Aluminum Wafer Bonding
    Rebhan, B.
    Hinterreiter, A.
    Malik, N.
    Schjolberg-Henriksen, K.
    Dragoi, V.
    Hingerl, K.
    SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14, 2016, 75 (09): : 15 - 24
  • [30] NATURAL AIR LOW-TEMPERATURE - CROP DRYING
    HELLEVANG, KJ
    NORTH DAKOTA COOPERATIVE EXTENSION SERVICE EXTENSION BULLETIN, 1983, (35): : 1 - 27
12345