Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements

被引：0

作者：

K. I. Delendik

N. V. Kolyago

O. G. Penyazkov

O. L. Voitik

机构：

[1] National Academy of Sciences of Belarus,A. V. Luikov Heat and Mass Transfer Institute

来源：

Journal of Engineering Physics and Thermophysics | 2019年 / 92卷

关键词：

heat pipe; wick; thermal resistance; light-emitting diode; cooling system; radiator;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

An algorithm for the development of heat pipes involving the choice of the working fluid, materials for the casing and wick, and the methods of calculating the limits of heat-transmitting ability of heat pipes is suggested. This algorithm has been applied successfully for creating different types of wicks and heat pipes on the basis of which a cooling system has been created for a high-power light-emitting diode lantern.

引用

页码：1529 / 1536

页数：7

共 14 条

[1]

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[2]

Koh S(2012)A review of heat pipe systems for heat recovery and renewable energy applications Renew. Sustain. Energy Rev. 16 2249-2259

[3]

Zeijl H(2007)Miniature heat pipes for thermal control of radio-electronic equipment Heat Transf. Res. 38 245-258

[4]

Gielen AWJ(2014)Heat pipes: review, opportunities and challenges Front. Heat Pipes 5 1-48

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