Polymer composites filled with core-shell structured nanofillers: effects of shell thickness on dielectric and thermal properties of composites (Feb, 10.1007/s10854-022-07705-z, 2022)

被引:0
作者
Cao, Dan [1 ]
Zhou, Wenying [1 ]
Yuan, Mengxue [2 ]
Li, Bo [3 ]
Li, Ting [1 ]
Li, Jin [1 ]
Liu, Dengfeng [1 ]
Wang, Guangheng [1 ]
Zhou, Juanjuan [1 ]
Zhang, Hongfang [4 ]
机构
[1] Xian Univ Sci Technol, Sch Chem & Chem Engn, Xian 710054, Peoples R China
[2] Penn State Univ, Mat Res Inst, University Pk, PA 16802 USA
[3] PolyK Technol, State Coll, PA 16803 USA
[4] Suzhou Univ Sci & Technol, Sch Phys Sci & Technol, Suzhou 215009, Peoples R China
基金
中国国家自然科学基金;
关键词
D O I
10.1007/s10854-022-07866-x
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, we explore poly(vinylidene fluoride) (PVDF) filled with the core–shell nanofillers of silicon dioxide-coated β-silicon carbide whisker (β-SiCw@SiO2), and investigate the effects of core–shell structure and shell thickness on the composite thermal and dielectric properties. The formation of an insulating SiO2 layer can not only substantially reduce the dielectric loss of polymer composites but also suppress their dielectric constant (k). Further increasing shell thickness continues inhibiting the dielectric loss while rendering the k nearly unaffected. We attribute the underlying mechanism to the different effects of shell thickness on long-range and short-range charge migration. In addition to the constraint on charge transport, the SiO2 shell improves the filler–polymer interfacial compatibility and therefore leads to a large improvement in the thermal conductivity (TC) of the composites. The synthesized core–shell fillers afford high k and enhanced TC as well as low loss in the composites, which would enable a wide range of applications in dielectric and electrical fields. © 2022, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.
引用
收藏
页码:5190 / 5191
页数:2
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