Effective Thermal Conductivity Measurement of Additively Manufactured Lattice Structures by Application of Modified Temperature Profile Method

被引:0
作者
Ryo Umemoto
Ai Ueno
Hosei Nagano
Masatsugu Otsuki
Tetsuro Ogushi
机构
[1] Nagoya University,Department of Mechanical System Engineering
[2] Japan Aerospace Exploration Agency,Institute of Space and Astronautical Science
[3] Advanced Knowledge Laboratory Inc.,undefined
[4] Heat Transfer & Cooling La.,undefined
来源
International Journal of Thermophysics | 2023年 / 44卷
关键词
Additive manufacturing; Effective thermal conductivity; Lattice structure; Steady state comparative-longitudinal heat flow method; Temperature profile method;
D O I
暂无
中图分类号
学科分类号
摘要
This study aims to establish a general-purpose thermal conductivity measurement method that can take into account the effect of heat loss under atmospheric conditions for measuring the effective thermal conductivity of lattice structures, and to clarify the effective thermal conductivity of lattice structures with different wire diameters. In this paper, calculations by finite element method and measurements using steady state comparative-longitudinal heat flow method and modified temperature profile method were performed to clarify the effective thermal conductivity of the five truncated octahedron unit-cell lattice structures with different wire diameters fabricated by additive manufacturing. The modified temperature profile method is developed to take into account the effect of interfacial thermal resistance in the measurement apparatus. The effective thermal conductivity measured using the steady state comparative-longitudinal heat flow method and calculated with finite element method analysis showed good agreement, confirming that the effective thermal conductivity is strongly dependent on the wire diameter. The effective thermal conductivity obtained by the modified temperature profile (MTP) method was 3 % to 24 % smaller than that obtained by the steady state comparative-longitudinal heat flow method, and the measurement was able to take heat loss into account more concretely. Furthermore, measurements using the MTP method enabled us to obtain reasonable values for the ratio of heat loss in each section, the fin efficiency of the sample, the heat transfer coefficient to the surroundings, and the interfacial thermal resistance between the rods and the sample.
引用
收藏
相关论文
共 98 条
  • [1] Korkmaz ME(2022)Development of lattice structure with selective laser melting process: a state of the art on properties, future trends and challenges J. Manuf. Process. 81 1040-1063
  • [2] Gupta MK(2020)Review on characterization and impacts of the lattice structure in additive manufacturing Mater. Today Proc. 21 916-919
  • [3] Robak G(2021)Additive manufacturing of metallic lattice structures: unconstrained design, accurate fabrication, fascinated performances, and challenges Mater. Sci. Eng. R Rep. 146 100648-120
  • [4] Moj K(2019)Optimised lattice structure configuration for additive manufacturing CIRP Ann. 68 117-1177
  • [5] Krolczyk GM(2020)Topology-optimized lattice structures with simultaneously high stiffness and light weight fabricated by selective laser melting: design, manufacturing and characterization J. Manuf. Process. 56 1166-119
  • [6] Kuntoğlu M(2018)Effects of cell morphology and heat treatment on impact energy absorption property of porous aluminum used for landing gears of a small satellite Aerosp. Technol. Jpn. 17 115-99
  • [7] Nagesha BK(2021)A feasibility study on additive manufactured hybrid metal/composite shock absorbers Compos. Struct. 268 113958-313
  • [8] Dhinakaran V(2018)Selective electron beam manufactured Ti–6Al–4V lattice structures for orthopedic implant applications: current status and outstanding challenges Curr. Opin. Solid State Mater. Sci. 22 75-385
  • [9] Varsha Shree M(2016)Cellular lattices of biomedical Co–Cr–Mo-alloy fabricated by electron beam melting with the aid of shape optimization Addit. Manuf. 12 305-287
  • [10] Manoj Kumar KP(2021)Thermal performance of a 3D printed lattice-structure heat sink packaging phase change material Chin. J. Aeronaut. 34 373-298