Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions

被引:0
作者
Susumu Arai
Miyoka Ueda
机构
[1] Shinshu University,Department of Materials Chemistry, Faculty of Engineering
来源
Journal of Applied Electrochemistry | 2020年 / 50卷
关键词
Copper; Diamond; Composite; Thermal conductivity; Electrodeposition; Galvanostatic condition; Potentiostatic condition;
D O I
暂无
中图分类号
学科分类号
摘要
引用
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页码:631 / 638
页数:7
相关论文
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