A review of heat pipe technology for foldable electronic devices

被引：74
作者：
Gibbons, Michael J. [1 ]
Marengo, Marco [2 ]
Persoons, Tim [1 ]
机构：
[1] Univ Dublin, Trinity Coll Dublin, Dept Mech Mfg & Biomed Engn, Dublin 2, Ireland
[2] Univ Brighton, Adv Engn Ctr, Brighton BN2 4GJ, E Sussex, England
来源：
APPLIED THERMAL ENGINEERING | 2021年 / 194卷
关键词：
Electronic cooling; Flexible heat pipe; Thermal ground plane; Thermal spreader; Vapor chamber; Thermal management; THIN VAPOR CHAMBER; THERMAL PERFORMANCE; DROPWISE CONDENSATION; WICK; FABRICATION; MECHANISMS; SPREADERS; CHANNELS; SURFACE; DESIGN;
D O I：
10.1016/j.applthermaleng.2021.117087
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and Huawei Mate X (2019), require increased battery size and processor performance to drive their larger flexible displays. There is a growing need to develop flexible thermal management solutions to cool these foldable electronic devices. This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology. This review discusses various types of heat pipes, their thermal performance, novel manufacturing processes, and the open research questions, challenges, together with the potential future directions of this research area.
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页数：26
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