Effect of Sn Alloying on the Diffusion Bonding Behavior of Al-Mg-Si Alloys

被引：9
|
作者：
Atabay, Sila Ece [1 ]
Esen, Ziya [2 ]
Dericioglu, Arcan F. [1 ]
机构：
[1] Middle East Tech Univ, Met & Mat Engn Dept, TR-06800 Ankara, Turkey
[2] Cankaya Univ, Dept Mat Sci & Engn, TR-06810 Ankara, Turkey
来源：
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2017年 / 48A卷 / 07期
关键词：
SURFACE-ROUGHNESS; ALUMINUM-ALLOY; STRENGTH; JOINTS;
D O I：
10.1007/s11661-017-4089-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Effect of Sn as an alloying element on the diffusion-bonding behavior of Al-Mg-Si alloy has been studied by means of differential scanning calorimetry (DSC), X-ray diffraction (XRD), scanning electron microscopy (SEM) and mechanical testing of the diffusion-bonded joint. XRD results revealed the formation of Mg2Sn and (Sn) phases during solidification following induction casting. DSC results showed local liquid (Sn) formation during the bonding process for Sn-containing alloys, where its amount was found to be increasing with the increasing Sn content. Results revealed that Sn addition leads to an increase in the bond shear strength of the diffusion-bonded joints and elimination of the irregularities formed on the bonded interface. Fractured surfaces showed that formation of (Sn) layer at the bonded interface causes the fracture to transform from the ductile to the mixed fracture mode.
引用
收藏
页码：3181 / 3187
页数：7
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