Advanced Thermoelectric Materials for Flexible Cooling Application

被引:69
作者
Ding, Jiamin [1 ,2 ]
Zhao, Wenrui [1 ,2 ]
Jin, Wenlong [1 ,2 ]
Di, Chong-an [1 ]
Zhu, Daoben [1 ]
机构
[1] Chinese Acad Sci, Beijing Natl Lab Mol Sci, Inst Chem, CAS Key Lab Organ Solids, Beijing 100190, Peoples R China
[2] Univ Chinese Acad Sci, Sch Chem Sci, Beijing 100049, Peoples R China
关键词
device design; flexible thermoelectric cooling; inorganic thermoelectric films; organic thermoelectric materials; peltier effect;
D O I
10.1002/adfm.202010695
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Flexible cooling devices, which aim to fulfill the essential requirement of complex working environments and enable local heat dissipation, have become the cutting-edge area of refrigeration technology. Thermoelectric (TE) material represents a promising candidate for various flexible cooling applications, including wearable personal thermoregulation devices. With the increasing interest in the Peltier effect of conductive polymers and inorganic films on flexible substrates, flexible cooling devices have undergone rapid development. Herein, the fundamental mechanisms, basic parameters, and temperature measurement techniques for evaluating the cooling performance are summarized. Moreover, recent progress on TE materials, such as flexible inorganic and organic materials for Peltier cooling studies, is reviewed. More importantly, insights are provided into the key strategies for high-performance Peltier devices. The final part details the existing challenges and perspectives on flexible TE cooling to inspire additional research interests toward the advancement of refrigeration technology.
引用
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页数:17
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共 69 条
  • [1] Enhancement of graphene thermoelectric performance through defect engineering
    Anno, Yuki
    Imakita, Yuki
    Takei, Kuniharu
    Akita, Seiji
    Arie, Takayuki
    [J]. 2D MATERIALS, 2017, 4 (02):
  • [2] Carbon-Nanotube-Based Thermoelectric Materials and Devices
    Blackburn, Jeffrey L.
    Ferguson, Andrew J.
    Cho, Chungyeon
    Grunlan, Jaime C.
    [J]. ADVANCED MATERIALS, 2018, 30 (11)
  • [3] Size and interface effects on thermal conductivity of superlattices and periodic thin-film structures
    Chen, G
    [J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1997, 119 (02): : 220 - 229
  • [4] Chen SS, 2012, NAT MATER, V11, P203, DOI [10.1038/nmat3207, 10.1038/NMAT3207]
  • [5] Microscale and Nanoscale Thermal Characterization Techniques (Reprinted from Thermal Issues in Emerging Technologies: Theory and Application, January, 2007)
    Christofferson, J.
    Maize, K.
    Ezzahri, Y.
    Shabani, J.
    Wang, X.
    Shakouri, A.
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2008, 130 (04)
  • [6] CsBi4Te6:: A high-performance thermoelectric material for low-temperature applications
    Chung, DY
    Hogan, T
    Brazis, P
    Rocci-Lane, M
    Kannewurf, C
    Bastea, M
    Uher, C
    Kanatzidis, MG
    [J]. SCIENCE, 2000, 287 (5455) : 1024 - 1027
  • [7] Peltier cooling in molecular junctions
    Cui, Longji
    Miao, Ruijiao
    Wang, Kun
    Thompson, Dakotah
    Angela Zotti, Linda
    Carlos Cuevas, Juan
    Meyhofer, Edgar
    Reddy, Pramod
    [J]. NATURE NANOTECHNOLOGY, 2018, 13 (02) : 122 - +
  • [8] Dresselhaus M.S, 1992, MRS P, V281, P450, DOI [10.1557/PROC-281-821, DOI 10.1557/PROC-281-821]
  • [9] Flexible thermoelectric materials and devices
    Du, Yong
    Xu, Jiayue
    Paul, Biplab
    Eklund, Per
    [J]. APPLIED MATERIALS TODAY, 2018, 12 : 366 - 388
  • [10] Thermoelectric properties of zinc antimonide thin film deposited on flexible polyimide substrate by RF magnetron sputtering
    Fan, Ping
    Fan, Wei-fang
    Zheng, Zhuang-hao
    Zhang, Yin
    Luo, Jing-ting
    Liang, Guang-xing
    Zhang, Dong-ping
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (11) : 5060 - 5065