共 37 条
[1]
Bogatin E., 2009, SIGNAL POWER INTEGRI
[3]
Choi J., 2005, P EUR MICR C OCT, V3, P279
[6]
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2010, 33 (03)
:617-622
[7]
Efficient Method for Modeling of SSN Using Time-Domain Impedance Function and Noise Suppression Analysis
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2012, 2 (03)
:510-520
[9]
Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2013, 3 (01)
:21-30
[10]
Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2007, 30 (02)
:180-190