Power Optimal Network-on-Chip Interconnect Design

被引:0
|
作者
Vikas, G. [1 ]
Kuri, Joy [1 ]
Varghese, Kuruvilla [1 ]
机构
[1] Indian Inst Sci, Ctr Elect Design & Technol, Bangalore 560012, Karnataka, India
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A large part of today's multi-core chips is interconnect. Increasing communication complexity has made essential new strategies for interconnects, such as Network on Chip. Power dissipation in interconnects has become a substantial part of the total power dissipation. Techniques to reduce interconnect power have thus become a necessity. In this paper, we present a design methodology that gives values of bus width for interconnect links, frequency of operation for routers, in Network on Chip scenario that satisfy required throughput and dissipate minimal switching power. We develop closed form analytical expressions for the power dissipation, with bus width and frequency as variables and then use Lagrange multiplier method to arrive at the optimal values. We present a 4 port router in 90 nm technology library as case study. The results obtained from analysis are discussed.
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收藏
页码:147 / 150
页数:4
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