Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

被引：22

作者：

Bachy, Bassim ^{[1
,3
]}

Suess-Wolf, Robert ^{[1
]}

Wang, Li ^{[1
]}

Fu, Zongwen ^{[2
]}

Travitzky, Nahum ^{[2
]}

Greil, Peter ^{[2
]}

Franke, Joerg ^{[1
]}

机构：

[1] Friedrich Alexander Univ Erlangen Nurnberg, Inst Factory Automat & Prod Syst, Further Str 246b, D-90429 Nurnberg, Germany

[2] Friedrich Alexander Univ Erlangen Nurnberg, Inst Glass & Ceram, Dept Mat Sci, Martensstr 5, D-91058 Erlangen, Germany

[3] Univ Baghdad, Coll Engn, Dept Mech, Baghdad, Iraq

来源：

ADVANCED ENGINEERING MATERIALS | 2018年 / 20卷 / 07期

关键词：

High-Performance Ceramics; Laser Direct Structuring; Molded Interconnect Devices;

D O I：

10.1002/adem.201700824

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS (R) technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity', and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16m/20m is achieved.

引用

页数：10

共 22 条

[1] Development of a ceramic-based composite for direct bonded copper substrate [J].