The mechanism of void formation in the growth of 3C-SiC thin film in Si substrate

被引:4
作者
Seo, YH [1 ]
Kim, KC
Shim, HW
Nahm, KS
Suh, EK
Lee, HJ
Hwang, YG
Kim, DK
Lee, BT
机构
[1] Chonbuk Natl Univ, Sch Chem Engn & Technol, Chonju 560756, South Korea
[2] Chonbuk Natl Univ, Dept Semicond Sci & Technol, Chonju 560756, South Korea
[3] Chonbuk Natl Univ, Dept Phys, Chonju 560756, South Korea
[4] Chonbuk Natl Univ, Semicond Phys Res Ctr, Chonju 560756, South Korea
[5] Wonkwang Univ, Dept Phys, Iksan 570749, South Korea
[6] Chonnam Natl Univ, Dept Met Engn, Kwangju 500757, South Korea
来源
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2 | 1998年 / 264-2卷
关键词
void-free; 3C-SiC; void formation mechanism; rapid-thermal CVD; tetramethylsilane;
D O I
10.4028/www.scientific.net/MSF.264-268.199
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of growth parameters has been examined for the epitaxial growth of void-free SiC film on Si substrate. Void-free single crystalline SiC films were grown when the Si substrate was heated after the flow of TMS. The increase of TMS flow rate grew void-free SiC films, but the crystallinity of the films varied from single crystalline to polycrystalline with increasing TMS flow rates. The growth of void-free single crystalline SiC films was observed at substrate temperatures below 1000 degrees C. The mechanism of the void formation was briefly discussed in this work.
引用
收藏
页码:199 / 202
页数:4
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