Heat transfer in laser sintering of thick-film microelectronics

被引：0

作者：

Kinzel, Edward C. ^{[1
]}

Xu, Xianfan ^{[1
]}

Sigmarsson, Hjalti H. ^{[1
]}

Chappell, William J. ^{[1
]}

机构：

[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA

来源：

Proceedings of the ASME Heat Transfer Division 2005, Vol 2 | 2005年 / 376-2卷

关键词：

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper investigates fabrication of functional thick-film components using Selective Laser Sintering (SLS). We demonstrated that SLS has exciting potentials for thick-film metallization of low-temperature substrates. The DC conductivity of laser sintered components is measured for a range of laser scan speeds and powers. The quality of metallization at microwave frequencies is evaluated by comparing the measured Q to simulations. The effects of processing parameters on the quality of components are investigated through a heat transfer analysis of the laser sintering process. Optimum properties of the fabricated components are obtained when proper thermal conditions are achieved during laser heating.

引用

页码：895 / 901

页数：7

共 13 条

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