Realizing high-strength diffusion bonding of copper at ultra-low temperatures via single point diamond turning and spark plasma sintering

被引：14
作者：
Li, Wendi [1 ,2 ]
Liang, Yuxin [1 ]
Bai, Yang [1 ]
Lin, Tiesong [1 ,2 ]
Li, Bangsheng [1 ,2 ,3 ]
Fu, Zhiqiang [4 ]
Feng, Jicai [1 ,2 ]
机构：
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[3] Harbin Inst Technol, Natl Key Lab Precis Hot Proc Met, Harbin 150001, Peoples R China
[4] South China Univ Technol, Guangdong Key Lab Adv Met Mat Proc, Guangzhou 510640, Guangdong, Peoples R China
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2022年 / 857卷
关键词：
Diffusion bonding; Copper; Spark plasma sintering; Single point diamond turning; RECRYSTALLIZATION; ALLOY;
D O I：
10.1016/j.msea.2022.144116
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Single point diamond turning (SPDT) could produce nanoscale surface roughness and surface nanograins. When subsequently heated by spark plasma sintering (SPS), the SPDT processed copper realized diffusion bonding at an ultra-low temperature of-202 degrees C (0.35 Tm). Finally, high-strength (-269 MPa) diffusion bonding of copper was achieved via SPDT and SPS.
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页数：5
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