Half-Thru De-embedding Method for Millimeter-Wave and Sub-Millimeter-Wave Integrated Circuits

被引：2

作者：

Velayudhan, Vipin ^{[1
]}

Pistono, Emmanuel ^{[2
]}

Arnould, Jean-Daniel ^{[2
]}

机构：

[1] Univ Grenoble Alpes, IMEP LAHC, F-38000 Grenoble, France

[2] Univ Grenoble Alpes, IMEP LAHC, CNRS, F-38000 Grenoble, France

来源：

2014 10TH CONFERENCE ON PH.D. RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2014) | 2014年

关键词：

De-embedding methods; characterization; millimeter wave; sub-millimeter wave; integrated circuits; S-CPW transmission lines; DESIGN; LINE;

D O I：

10.1109/PRIME.2014.6872692

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An accurate de-embedding method for millimeter-wave and sub-millimeter-wave integrated circuits is presented. In this "Half-Thru" de-embedding method, the pad-interconnects parasitics effects are modeled as a Half-Thru structure from both parts of the device under test. Several de-embedding methods over millimeter and sub-millimeter wave frequencies are compared in integrated technology by considering S-CPW transmission lines as device under test. From these comparisons we propose an effective way to de-embed transmission lines. The S-CPW transmission line model and results are obtained from full-wave electromagnetic simulations in BiCMOS 55-nm technology.

引用

页数：4

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