Path Loss Model as a Function of Antenna Height for 300 GHz Chip-to-Chip Communications

被引：0

作者：

Fu, Jinbang ^{[1
]}

Juyal, Prateek ^{[1
]}

Zajid, Alenka G. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

2019 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND USNC-URSI RADIO SCIENCE MEETING | 2019年

基金：

美国国家科学基金会;

关键词：

CHANNEL;

D O I：

10.1109/apusncursinrsm.2019.8888326

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the path loss model of Terahertz (THz) wireless channel inside a desktop size metal enclosure as a function of antenna height. Measurements for line-of-sight (LoS) propagation inside the metal box show that path loss varies with respect to the transceiver's height from the bottom wall, and for some heights, the path loss is lower than the free space value. Analysis based on the cavity modes shows that the first eight TE modes dominate the resonating modes inside the box. Also, the path loss analysis indicates that the resonating modes combined with the reflections inside the box are responsible for the strong ripples in the path loss curve.

引用

页码：1275 / 1276

页数：2

共 50 条

[21] CHIP-TO-CHIP ELECTRICAL INTERCONNECT TRANSMITS 1.8-ps PULSES FROM 50 TO 300 GHz
不详
MICROWAVES & RF, 2013, 52 (11) : 34 - 34
[22] Chip-to-Chip Switched Beam 60 GHz Circular Patch Planar Antenna Array and Pattern Considerations
Baniya, Prabhat
Bisognin, Aimeric
Melde, Kathleen L.
Luxey, Cyril
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2018, 66 (04) : 1776 - 1787
[23] Chip-to-chip RF Communications and Power Delivery via On-chip Antennas
Carley, L. Richard
MOBICOM'18: PROCEEDINGS OF THE 24TH ANNUAL INTERNATIONAL CONFERENCE ON MOBILE COMPUTING AND NETWORKING, 2018, : 655 - 656
[24] Sub-THz Interconnect for Planar Chip-to-Chip Communications
Yu, Bo
Ye, Yu
Ding, Xuan
Neher, Christian
Liu, Xiaoguang
Xu, Zhiwei
Gu, Qun Jane
2018 IEEE 18TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2018, : 54 - 56
[25] Interface circuits for chip-to-chip data transfer at GHz rates
Przybysz, JX
Miller, DL
Martinet, SS
Kang, JH
Worsham, AH
Farich, ML
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 1997, 7 (02) : 2657 - 2660
[26] Ultrawideband design challenges for wireless chip-to-chip communications and interconnects
Celebi, Hasari
Ahin, Mustafa E.
Arslan, Huseyin
Haque, Jamal
Prado, Edward R.
Markell, David P.
2006 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2006, : 2408 - +
[27] Switched Beam SIW Horn Arrays at 60 GHz for 360° Reconfigurable Chip-to-Chip Communications With Interference Considerations
Baniya, Prabhat
Melde, Kathleen L.
IEEE ACCESS, 2021, 9 : 100460 - 100471
[28] Planar Dielectric Rod Antenna for Gigabyte Chip-to-Chip Communication
Ghassemi, Nasser
Wu, Ke
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2012, 60 (10) : 4924 - 4928
[29] Millimeter-Wave Chip-to-Chip Transmission Using an Insulated Image Guide Excited by an On-Chip Dipole Antenna at 90 GHz
Dolatsha, Nemat
Hesselbarth, Jan
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2012, 22 (05) : 266 - 268
[30] A 1 GHz CMOS transimpedance amplifier for chip-to-chip optical interconnects
Haralabidis, N
Katsafouros, S
Halkias, G
ISCAS 2000: IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS - PROCEEDINGS, VOL V: EMERGING TECHNOLOGIES FOR THE 21ST CENTURY, 2000, : 421 - 424

← 1 2 3 4 5 →