Mechanical behavior of mismatch strain-driven microcantilever

被引:2
作者
Kim, Sang-Hyun
Boyd, James G.
Mani, Sathyanarayanan
机构
[1] Samsung Adv Inst Technol, Micro Device & Syst Lab, Younggin 449712, Gyunggi, South Korea
[2] Texas A&M Univ, Dept Aerosp Engn, College Stn, TX 77843 USA
[3] Univ Illinois, Dept Mech & Ind Engn, Urbana, IL 61801 USA
基金
美国国家航空航天局; 美国国家科学基金会;
关键词
mismatch strain; electroplated nickel; microcantilever; electrodeposition;
D O I
10.1016/j.mejo.2007.01.010
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A model of mechanical behavior of microcantilever due to mismatch strain during deposition of MEMS structures is derived. First, a microcantilever, modeled as an Euler-Bernoulli beam, is subjected to deposition of another material and a linear ordinary differential equation which considers the through-thickness variation of the mismatch strain is derived. Second, the deposition analysis is experimentally realized by electroplating of nickel onto an atomic force microscope (AFM) cantilever beam. Young's modulus of the electroplated nickel film is determined by using Sader's method and elementary beam theory. The deflection of the AFM cantilever is insitu measured as a function of the electroplated thin film thickness through the optical method of AFM and the mismatch strain with the through-thickness variation is determined from the experiment results. (C) 2007 Elsevier Ltd. All rights reserved.
引用
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页码:371 / 380
页数:10
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