共 32 条
[1]
Abe T., 1994, SEMICONDUCTOR SILICO
[2]
[Anonymous], 1994, P 7 INT S SIL MAT SC
[3]
MEASUREMENT OF SUBSURFACE DAMAGE IN SILICON-WAFERS
[J].
PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING,
1994, 16 (02)
:139-144
[5]
Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
[J].
ADVANCES IN ABRASIVE TECHNOLOGY XIII,
2010, 126-128
:113-118
[9]
Theoretical model of brittle material removal fraction related to surface roughness and subsurface damage depth of optical glass during precision grinding
[J].
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,
2017, 49
:421-427