The impact of SiNx gate insulators on amorphous indium-gallium-zinc oxide thin film transistors under bias-temperature-illumination stress

被引:42
|
作者
Jung, Ji Sim [1 ]
Son, Kyoung Seok [1 ]
Lee, Kwang-Hee [1 ]
Park, Joon Seok [1 ]
Kim, Tae Sang [1 ]
Kwon, Jang-Yeon [1 ]
Chung, Kwun-Bum [2 ]
Park, Jin-Seong [3 ]
Koo, Bonwon [1 ]
Lee, Sangyun [1 ]
机构
[1] Samsung Adv Inst Technol, Display Device & Proc Lab, Yongin 446712, South Korea
[2] Dankook Univ, Dept Phys, Cheonan 330714, South Korea
[3] Dankook Univ, Dept Mat Sci & Engn, Cheonan 330714, South Korea
关键词
amorphous semiconductors; gallium compounds; II-VI semiconductors; indium compounds; semiconductor device reliability; semiconductor thin films; semiconductor-insulator boundaries; silicon compounds; thin film transistors; wide band gap semiconductors; CHEMICAL-VAPOR-DEPOSITION; SILICON; SEMICONDUCTOR; INSTABILITY;
D O I
10.1063/1.3429588
中图分类号
O59 [应用物理学];
学科分类号
摘要
The threshold voltage instability (V-th) in indium-gallium-zinc oxide thin film transistor was investigated with disparate SiNx gate insulators under bias-temperature-illumination stress. As SiNx film stress became more tensile, the negative shift in V-th decreased significantly from -14.34 to -6.37 V. The compressive films exhibit a nitrogen-rich phase, higher hydrogen contents, and higher N-H bonds than tensile films. This suggests that the higher N-H related traps may play a dominant role in the degradation of the devices, which may provide and/or generate charge trapping sites in interfaces and/or SiNx insulators. It is anticipated that the appropriate optimization of gate insulator properties will help to improve device reliability. (C) 2010 American Institute of Physics. [doi:10.1063/1.3429588]
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页数:3
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