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The impact of SiNx gate insulators on amorphous indium-gallium-zinc oxide thin film transistors under bias-temperature-illumination stress
被引:42
|作者:
Jung, Ji Sim
[1
]
Son, Kyoung Seok
[1
]
Lee, Kwang-Hee
[1
]
Park, Joon Seok
[1
]
Kim, Tae Sang
[1
]
Kwon, Jang-Yeon
[1
]
Chung, Kwun-Bum
[2
]
Park, Jin-Seong
[3
]
Koo, Bonwon
[1
]
Lee, Sangyun
[1
]
机构:
[1] Samsung Adv Inst Technol, Display Device & Proc Lab, Yongin 446712, South Korea
[2] Dankook Univ, Dept Phys, Cheonan 330714, South Korea
[3] Dankook Univ, Dept Mat Sci & Engn, Cheonan 330714, South Korea
关键词:
amorphous semiconductors;
gallium compounds;
II-VI semiconductors;
indium compounds;
semiconductor device reliability;
semiconductor thin films;
semiconductor-insulator boundaries;
silicon compounds;
thin film transistors;
wide band gap semiconductors;
CHEMICAL-VAPOR-DEPOSITION;
SILICON;
SEMICONDUCTOR;
INSTABILITY;
D O I:
10.1063/1.3429588
中图分类号:
O59 [应用物理学];
学科分类号:
摘要:
The threshold voltage instability (V-th) in indium-gallium-zinc oxide thin film transistor was investigated with disparate SiNx gate insulators under bias-temperature-illumination stress. As SiNx film stress became more tensile, the negative shift in V-th decreased significantly from -14.34 to -6.37 V. The compressive films exhibit a nitrogen-rich phase, higher hydrogen contents, and higher N-H bonds than tensile films. This suggests that the higher N-H related traps may play a dominant role in the degradation of the devices, which may provide and/or generate charge trapping sites in interfaces and/or SiNx insulators. It is anticipated that the appropriate optimization of gate insulator properties will help to improve device reliability. (C) 2010 American Institute of Physics. [doi:10.1063/1.3429588]
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页数:3
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