Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

被引：0
|
作者：
Moroka, Kouichi [1 ]
Kariya, Yoshiharu [2 ]
机构：
[1] Shibaura Inst Technol, Grad Sch, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan
[2] Shibaura Inst Technol, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
D O I：
10.23919/ltb-3d.2019.8735151
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The fatigue life of a joint in the semiconductor package decreases with an increase in creep deformation associated with microstructural changes occurred while in use. Particularly, the life difference in the field is remarkable. In life prediction, considering microstructural changes is absolutely necessary.
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收藏
页码：48 / 48
页数：1
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