Hybrid additive manufacture: Surface finishing methods for improving conductivity of inkjet printed tracks on non-planar substrates fabricated using fused deposition modeling

被引:14
作者
Griffiths, Elliott R. [1 ]
Leigh, Simon J. [1 ]
机构
[1] Univ Warwick, Sch Engn, Coventry CV4 7AL, Warwick, England
基金
英国工程与自然科学研究理事会;
关键词
Inkjet printing; Fused deposition modeling; Embedded electronics; Hybrid additive manufacture; ELECTRONICS; PARTS; INTEGRATION; ROUGHNESS; CIRCUITS; SENSORS;
D O I
10.1016/j.sna.2021.113235
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study investigates the impact of the surface quality of 3D printed non-planar surfaces on the conductivity of an inkjet-printed silver nano-particle ink, in the context of fused deposition modeling; a type of additive manufacture (3D pritnting). It was observed that the as-printed surface finish resulted in continuity breaks together with reduced and overall poor batch consistency of conductivity (SDbatch = 16.51 mS/ mm). Therefore, to pave the way for high density, consistent and repeatable electronic tracks, the surface finish of as-printed 3D printed parts must be improved. To mitigate this, several finishing methods were investigated, CNC machining, non-planar nozzle ironing and the technique of burnishing with a custommade heated tool. Of all the investigated finishing techniques, burnishing was identified as the most effective solution that ensured a high and consistent conductivity across the surface for subsequently printed nanoparticle tracks (SDbatch = 2.88 mS/mm). The combination of non-planar burnishing and non-planar printed electronics is key to unlocking the possibility of completely embedded 3D electronics and sensors in 3D printed objects and components.(C) 2021 Elsevier B.V. All rights reserved.
引用
收藏
页数:9
相关论文
共 25 条
[1]   Embedding electronics in 3D printed structures by combining fused filament fabrication and supersonic cluster beam deposition [J].
Bellacicca, Andrea ;
Santaniello, Tommaso ;
Milani, Paolo .
ADDITIVE MANUFACTURING, 2018, 24 :60-66
[2]   Roughness prediction in coupled operations of fused deposition modeling and barrel finishing [J].
Boschetto, Alberto ;
Bottini, Luana .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2015, 219 :181-192
[3]   Fully printed electronics on flexible substrates: High gain amplifiers and DAC [J].
Chang, Joseph ;
Zhang, Xi ;
Ge, Tong ;
Zhou, Jia .
ORGANIC ELECTRONICS, 2014, 15 (03) :701-710
[4]   Vapor smoothing process for surface finishing of FDM replicas [J].
Chohan, Jasgurpreet Singh ;
Singh, Rupinder ;
Boparai, Kamaljit Singh .
MATERIALS TODAY-PROCEEDINGS, 2020, 26 :173-179
[5]   Electroanalysis moves towards paper-based printed electronics: carbon black nanomodified inkjet-printed sensor for ascorbic acid detection as a case study [J].
Cinti, Stefano ;
Colozza, Noemi ;
Cacciotti, Ilaria ;
Moscone, Danila ;
Polomoshnov, Maxim ;
Sowade, Enrico ;
Baumann, Reinhard R. ;
Arduini, Fabiana .
SENSORS AND ACTUATORS B-CHEMICAL, 2018, 265 :155-160
[6]   Data management techniques for Internet of Things [J].
Diene, Bassirou ;
Rodrigues, Joel J. P. C. ;
Diallo, Ousmane ;
Malick Ndoye, El Hadji ;
Korotaev, Valery V. .
MECHANICAL SYSTEMS AND SIGNAL PROCESSING, 2020, 138
[7]   3D Printing multifunctionality: structures with electronics [J].
Espalin, David ;
Muse, Danny W. ;
MacDonald, Eric ;
Wicker, Ryan B. .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2014, 72 (5-8) :963-978
[8]   3D printing electronic components and circuits with conductive thermoplastic filament [J].
Flowers, Patrick F. ;
Reyes, Christopher ;
Ye, Shengrong ;
Kim, Myung Jun ;
Wiley, Benjamin J. .
ADDITIVE MANUFACTURING, 2017, 18 :156-163
[9]   Industry 4.0, digitization, and opportunities for sustainability [J].
Ghobakhloo, Morteza .
JOURNAL OF CLEANER PRODUCTION, 2020, 252
[10]  
Griffiths ER, 2019, SENSOR ACTUAT A-PHYS, V296, P272, DOI [10.1016/j.sha.2019.07.034, 10.1016/j.sna.2019.07.034]