Grain-boundary grooving and agglomeration of alloy thin films with a slow-diffusing species

被引:39
作者
Bouville, Mathieu [1 ]
Chi, Dongzhi
Srolovitz, David J.
机构
[1] Inst Mat Res & Engn, Singapore 117602, Singapore
[2] Yeshiva Univ, Dept Phys, New York, NY 10033 USA
关键词
D O I
10.1103/PhysRevLett.98.085503
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
We present a general phase-field model for grain-boundary grooving and agglomeration of polycrystalline alloy thin films. In particular, we study the effects of slow-diffusing species on the grooving rate. As the groove grows, the slow species becomes concentrated near the groove tip so that further grooving is limited by the rate at which it diffuses away from the tip. At early times the dominant diffusion path is along the boundary, while at late times it is parallel to the substrate. This change in path strongly affects the time dependence of grain-boundary grooving and increases the time to agglomeration. The present model provides a tool for agglomeration-resistant thin film alloy design.
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页数:4
相关论文
共 17 条
[1]  
[Anonymous], J PHYS PARIS
[2]   SURFACE TENSIONS IN THE SYSTEM SOLID COPPER MOLTEN LEAD [J].
BAILEY, GLJ ;
WATKINS, HC .
PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1950, 63 (365) :350-&
[3]   Phase-field model for grain boundary grooving in multi-component thin films [J].
Bouville, Mathieu ;
Hu, Shenyang ;
Chen, Long-Qing ;
Chi, Dongzhi ;
Srolovitz, David J. .
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2006, 14 (03) :433-443
[4]   ON SPINODAL DECOMPOSITION [J].
CAHN, JW .
ACTA METALLURGICA, 1961, 9 (09) :795-801
[5]   Applications of semi-implicit Fourier-spectral method to phase field equations [J].
Chen, LQ ;
Shen, J .
COMPUTER PHYSICS COMMUNICATIONS, 1998, 108 (2-3) :147-158
[6]   THE EFFECT OF STRESS ON GRAIN-BOUNDARY GROOVING [J].
GENIN, FY ;
MULLINS, WW ;
WYNBLATT, P .
ACTA METALLURGICA ET MATERIALIA, 1993, 41 (12) :3541-3547
[7]   Enhanced stability of Ni monosilicide on MOSFETs poly-Si gate stack [J].
Lee, PS ;
Mangelinck, D ;
Pey, KL ;
Ding, J ;
Chi, DZ ;
Osipowicz, T ;
Dai, JY ;
See, A .
MICROELECTRONIC ENGINEERING, 2002, 60 (1-2) :171-181
[8]   THE INSTABILITY OF POLYCRYSTALLINE THIN-FILMS - EXPERIMENT AND THEORY [J].
MILLER, KT ;
LANGE, FF ;
MARSHALL, DB .
JOURNAL OF MATERIALS RESEARCH, 1990, 5 (01) :151-160
[9]   THEORY OF THERMAL GROOVING [J].
MULLINS, WW .
JOURNAL OF APPLIED PHYSICS, 1957, 28 (03) :333-339
[10]   MODELING OF AGGLOMERATION IN POLYCRYSTALLINE THIN-FILMS - APPLICATION TO TISI2 ON A SILICON SUBSTRATE [J].
NOLAN, TP ;
SINCLAIR, R ;
BEYERS, R .
JOURNAL OF APPLIED PHYSICS, 1992, 71 (02) :720-724