Micromechanical simulation of grain boundary cavitation in copper considering non-proportional loading

被引:5
作者
Ozhoga-Maslovskaja, Oksana [1 ,2 ]
Naumenko, Konstantin [1 ]
Altenbach, Holm [1 ]
Prygorniev, Oleksandr [1 ]
机构
[1] Univ Magdeburg, Inst Mech, D-39106 Magdeburg, Germany
[2] Politecn Milan, Dept Mech Engn, I-20156 Milan, Italy
关键词
Creep; Copper microstructure; Cavity growth; Unit cell; Non-proportional loading; POLYCRYSTALLINE MATERIALS; DIFFUSIVE CAVITATION; CREEP; MODEL; TEMPERATURE; FRACTURE; ALLOY; LAW;
D O I
10.1016/j.commatsci.2014.08.050
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The influence of grain boundary cavitation on the overall creep response of polycrystal is investigated. The random polycrystalline microstructure is represented by means of unit cell, seeded with Voronoi tessellation. Grain boundaries are built as the planes with non zero thickness. For the grain boundary region a special material behavior is prescribed including grain boundary sliding and cavitation. Particular role of the stiffness reduction due to growing cavities in the grain boundary material during the tertiary creep stage is shown. The grain boundary cavitation, grain boundary sliding and power law creep deformation of the grain interior material are proven to be sufficient to represent phenomena observed during non-proportional loading tests in copper. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:178 / 184
页数:7
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