Methyl modified siloxane melting gels for hydrophobic films
被引:31
作者:
Jitianu, Andrei
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CUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USACUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
Jitianu, Andrei
[1
,2
]
Doyle, John
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Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USACUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
Doyle, John
[2
]
Amatucci, Glenn
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Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USA
Rutgers State Univ, Energy Storage Grp, Piscataway, NJ 08854 USACUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
Amatucci, Glenn
[2
,3
]
Klein, Lisa C.
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Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USACUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
Klein, Lisa C.
[2
]
机构:
[1] CUNY, Lehman Coll, Dept Chem, Bronx, NY 10468 USA
[2] Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USA
[3] Rutgers State Univ, Energy Storage Grp, Piscataway, NJ 08854 USA
Hybrid melting gels were prepared by a sol-gel process, starting with a mono-substituted siloxane and a di-substituted siloxane. Methyl-modified melting gels were prepared using (a) methyltriethoxysilane (MTES) with dimethyldiethoxysilane (DMDES) and (b) methyltrimethoxysilane (MTMS) together with dimethyldimethoxysilane (DMDMS). The gels with MTES-DMDES were prepared with concentrations between 50-50 and 75-25 mol%. The gels with MTMS-DMDMS were prepared with concentrations between 50-50 and 70-30 mol%. For both systems, the consolidation temperature, after which the melting gel no longer softens, increased with an increase in the amount of the mono-substituted siloxane, increasing from 135 to 160 A degrees C for MTES-DMDES and increasing from 145 to 170 A degrees C for MTMS-DMDMS. Coatings formed on mica substrates were about 1 mm thick, and showed no visible cracks. The surfaces of the coatings were profiled using micro-Raman spectroscopy, which revealed that methyl groups were concentrated at the surfaces of the films. All contact angles measured with water were greater than 90A degrees.
机构:
Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Gunji, T
;
Iizuka, Y
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Iizuka, Y
;
Arimitsu, K
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Arimitsu, K
;
Abe, Y
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
机构:
Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Gunji, T
;
Iizuka, Y
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Iizuka, Y
;
Arimitsu, K
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan
Arimitsu, K
;
Abe, Y
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Sci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, JapanSci Univ Tokyo, Fac Sci & Technol, Dept Pure & Appl Chem, Noda, Chiba 2788510, Japan