A Frequency-Splitting-Based Wireless Power and Data Transfer IC for Neural Prostheses with Simultaneous 115mW Power and 2.5Mb/s Forward Data Delivery

被引：13

作者：

Park, Yechan ^{[1
]}

Koh, Seok-Tae ^{[1
]}

Lee, Jeongeun ^{[2
]}

Kim, Hongkyun ^{[1
]}

Choi, Jaesuk ^{[1
]}

Ha, Sohmyung ^{[3
]}

Kim, Chul ^{[1
]}

Je, Minkyu ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Daejeon, South Korea

[2] Samsung Elect, Hwaseong, South Korea

[3] New York Univ Abu Dhabi, Abu Dhabi, U Arab Emirates

来源：

2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC) | 2021年 / 64卷

关键词：

D O I：

10.1109/ISSCC42613.2021.9365781

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：472 / +

页数：3

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