Relief of the residual stresses in Si3N4/Invar joints by multi-layered braze structure - Experiments and simulation
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作者:
Wang, Tianpeng
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Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R ChinaHarbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
Wang, Tianpeng
[1
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Ivas, Toni
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Empa, Swiss Fed Labs Mat Sci & Technol, CH-8600 Dubendorf, SwitzerlandHarbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
Ivas, Toni
[2
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Lee, Wookjin
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Korea Inst Ind Technol, 30,Gwahaksandan 1 Ro,60beon Gil, Busan 46742, South KoreaHarbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
Lee, Wookjin
[3
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Leinenbach, Christian
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Empa, Swiss Fed Labs Mat Sci & Technol, CH-8600 Dubendorf, SwitzerlandHarbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
Leinenbach, Christian
[2
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Zhang, Jie
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Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R ChinaHarbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
Zhang, Jie
[1
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机构:
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
An Ag-Cu-Ti+TiNp/Cu/Ag-Cu three-layered filler was designed to braze Si3N4 ceramic and Invar alloy. The effect of the Cu-foil thickness on the microstructure and the mechanical properties of the brazed joints was investigated. Compared with single-layer Ag-Cu-Ti+TiNp filler, the formation of Fe2Ti and Ni3Ti compounds is widely inhibited by using multi-layered filler. The shear strength of the brazed joint is 47.9% higher than that of joints brazed with single Ag-Cu-Ti+TiNp filler when a 200 mu m thick Cu interlayer is used. A simplified unit cell model was designed to obtain the physical properties of the TiNp reinforced filler. The model provides the elastic modulus and yield stress that satisfy the Hashin-Shtrikman bounds and N. Ramalcrishnan's equations, respectively. In the three-layered brazing, the finite element (FE) model shows that system residual stresses decrease significantly by increasing the thickness of Cu foil in the multi-layered system. (C) 2016 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
机构:
Res Ctr Computat Mech Inc, Dept Tech Dev, Shinagawa Ku, Tokyo 1420041, JapanRes Ctr Computat Mech Inc, Dept Tech Dev, Shinagawa Ku, Tokyo 1420041, Japan
机构:
Res Ctr Computat Mech Inc, Dept Tech Dev, Shinagawa Ku, Tokyo 1420041, JapanRes Ctr Computat Mech Inc, Dept Tech Dev, Shinagawa Ku, Tokyo 1420041, Japan