Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint

被引:1
作者
Lee, Choong-Jae [1 ]
Kim, Jae-Ha [1 ]
Jeong, Haksan [1 ]
Bang, Jae-Oh [2 ]
Jung, Seung-Boo [1 ]
机构
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 2066 Seobu Ro, Suwon 16419, South Korea
[2] SEMES Co Ltd, Photo Dev TF R&D Ctr, 77 4sandan 5 Gil, Cheonan 31040, South Korea
基金
新加坡国家研究基金会;
关键词
Epoxy Solder; Electromigration; Sn58Bi Solder; Reliability; Interconnection; MECHANICAL-PROPERTIES; FAILURE; MICROSTRUCTURE; NI; SEGREGATION; RELIABILITY; DISSOLUTION; GROWTH;
D O I
10.1166/sam.2020.3662
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
As demanding for high performance and miniaturization of electronic devices, interconnection materials required higher reliability in mechanical, thermal and electrical. The importance of electromigration issue has increased because of these trends. We evaluated the electromigration behavior of Sn58Bi solder and Sn58Bi epoxy solder under high temperature and constant current flow. The electromigration test-kit was a designed and fabricated flip chip-type module and the diameter of the solder bump was 250 mu m. A current was passed through the two solder joints, producing a current density of 3.0 x 10(3) A/cm(2) at 100 degrees C. The microstructure of solder joint after electromigration test were investigated with field-emission scanning electron microscopy during electromigration, a Bi-rich layer was observed at the anode side of the solder joint and the formation of Kirkendall voids was observed at the cathode side of the solder joints. Different inorganic materials affect electromigration in the eutectic Sn58Bi solder joints.
引用
收藏
页码:538 / 543
页数:6
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