Novel ultra-low power RF lateral BJT on SOI-CMOS compatible substrate

被引:0
作者
Sun, I-Shan Michael [1 ]
Ng, Wai Tung [1 ]
Mochizuki, Hidenori [1 ]
Kanekiyo, Koji [1 ]
Kobayashi, Takaaki [1 ]
Toita, Masato [1 ]
Imai, Hisaya [1 ]
Ishikawa, Akira [1 ]
Tamura, Satoru [1 ]
Takasuka, Kaoru [1 ]
机构
[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
来源
2005 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, PROCEEDINGS | 2005年
关键词
BiCMOS integrated circuits; silicon bipolar transistors; SOI; RF system-on-chip (RF SoC); lateral BJTs;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents a novel ultra-low power RF LBJT on SOL The fabrication process relies on polysilicon side-wall-spacer (PSWS) to self-atigned the base contact to the intrinsic base in the 100 nm range. The fabricated LBJTs exhibits superior Johnson's product (f(tau) x BVCEO) in the range between 190-300 GHz.V. The f(max) of the optimal device reaches 46 GHz at collector current density of only 0.15 m/mu m(2). Both figure-of-merit are in-line with advanced SiGe-HBT device, and superior than previously published data on lateral BJTs. This LBJT is built on SOI-CMOS compatible substrate, and is an ideal candidate for SOI-BiCMOS integration for RF and mixed-signal SoC.
引用
收藏
页码:317 / 320
页数:4
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