Selectivity investigation of HfO2 to oxide using wet etching

被引:3
作者
Kang, TK [1 ]
Wang, CC [1 ]
Tsui, BY [1 ]
Li, YH [1 ]
机构
[1] Feng Chia Univ, Dept Elect Engn, Taichung 40724, Taiwan
来源
2004 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP PROCEEDINGS | 2004年
关键词
D O I
10.1109/SMTW.2004.1393729
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Experiments indicate that higher HfO2/oxide etching selectivity in IPA/HF solution as compared to DI water/HF solution. Although DI water/HF solution is acceptable for some HfO2 and C VD oxide films, from an integration point of view, the process window is smaller than IPA/HF solution. It is believed that adequately damaged HfO2 and annealed CVD oxides will result in considerably high HfO2/CVD oxide etching selectivity in IPA/HF solution.
引用
收藏
页码:87 / 90
页数:4
相关论文
共 10 条
[1]  
CHAMBERS JJ, 2001, P 6 INT S CLEAN TECH, P359
[2]  
CLAES M, 2003, P 2 INT S HIGH DIEL, P165
[3]  
KEZUKA T, 2000, P 6 INT S CLEAN TECH, P244
[4]  
Lai CH, 2001, 2001 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS, PROCEEDINGS OF TECHNICAL PAPERS, P216
[5]   Experimental observations of the thermal stability of high-k gate dielectric materials on silicon [J].
Lysaght, PS ;
Chen, PJ ;
Bergmann, R ;
Messina, T ;
Murto, RW ;
Huff, HR .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2002, 303 (01) :54-63
[6]  
NIHAR R, 2002, IEEE T ELECTRON DEV, V49, P826
[7]  
Saenger KL, 2003, MATER RES SOC SYMP P, V745, P79
[8]  
SAENGER KL, 2003, IBM J RES DEV
[9]  
WOOD A, 2000, P 6 INT S CLEAN TECH, P258
[10]   Fringing-induced barrier lowering (FIBL) in sub-100nm MOSFETs with high-K gate dielectrics [J].
Yeap, GCF ;
Krishnan, S ;
Lin, MR .
ELECTRONICS LETTERS, 1998, 34 (11) :1150-1152