Embedded transmission-line (ETL) MMIC for low-cost high-density wireless communication applications

被引：5
|
作者：
Tserng, HQ [1 ]
Saunier, P
Ketterson, A
Witkowski, LC
Jones, T
机构：
[1] Raytheon TI Syst, RF Microwave GaAs Prod Dept, MMIC R&D Lab, Dallas, TX 75265 USA
[2] Raytheon TI Syst, Adv RF Syst Dept, Dallas, TX 75265 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1997年 / 45卷 / 12期
关键词：
MMIC amplifiers; MMIC phase shifters; MMIC's;
D O I：
10.1109/22.643871
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new embedded transmission-line (ETL) monolithic-microwave integrated-circuit (MMIC) approach which allows flexibility in mixing different transmission-line types (i.e., coplanar and striplines) for maximum MMIC design flexibility and permits the feasibility of eliminating backside processing for low production cost is described, This ETL MMIC approach is an enabling technology allowing for low-cost batch fabrication, and high-density integration of microwave and RF components (including silicon mixed-signal products) for emerging wireless communication applications, Designs and performance results of a number of ETL MMIC's are described in this paper.
引用
收藏
页码：2540 / 2548
页数：9
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