Ni-based FUSI gates: CMOS Integration for 45nm node and beyond

被引:0
|
作者
Hoffmann, T. [1 ]
Veloso, A. [1 ]
Lauwers, A. [1 ]
Yu, H. [1 ]
Tigelaar, H. [1 ]
Van Dal, M. [1 ]
Chiarella, T. [1 ]
Kerner, C. [1 ]
Kauerauf, T. [1 ]
Shickova, A. [1 ]
Mitsuhashi, R. [1 ]
Satoru, I. [1 ]
Niwa, M. [1 ]
Rothschild, A. [1 ]
Froment, B. [1 ]
Ramos, J. [1 ]
Nackaerts, A. [1 ]
Rosmeulen, M. [1 ]
Brus, S. [1 ]
Vrancken, C. [1 ]
Absil, P. P. [1 ]
Jurczak, M. [1 ]
Biesemans, S. [1 ]
Kittl, J. A. [1 ]
机构
[1] IMEC, Louvain, Belgium
来源
2006 INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 | 2006年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work reports the first comprehensive evaluation of FUSI gates for manufacturability, covering the key aspects of integration, process control, reliability, matching, device design and circuit-level benefit. Thanks to a selective and controlled poly etch-back process, dual work-function Ni-based FUSI CMOS circuits with record ring oscillator performance (high-V-T applications) have been achieved (17ps at V-DD=1.1V and 20pA/mu m I-off), meeting the ITRS 45nm node requirement for low power CMOS.
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页码:9 / +
页数:3
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