Development of flex stackable carriers

被引：4

作者：

Isaak, H ^{[1
]}

Uka, P ^{[1
]}

机构：

[1] Dense Pac Microsyst Inc, Garden Grove, CA 92841 USA

来源：

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/ECTC.2000.853181

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

CSP's and mu BGA's are becoming more common in the market place and present new challenges for stacking of devices. An investigation into possible methods of stacking these devices was undertaken. New materials such as z-axis epoxies and combination flux/underfill epoxies were considered as well as the possibilities of adhesiveless copper on flex for fine line etching. This paper describes the basic approach and the results of combining the new technologies into a versatile and novel stacking approach.

引用

页码：378 / 384

页数：3