Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate

被引：6

作者：

Okada, Atsuyuki ^{[1
,2
]}

Ogihara, Takashi ^{[2
]}

机构：

[1] Daiken Chem Co Ltd, Joto Ku, 7-9 Hanaten Nishi 2, Osaka 5360011, Japan

[2] Univ Fukui, Grad Sch Engn, Fiber Amen Engn, Fukui 9108507, Japan

来源：

ASIAN CERAMIC SCIENCE FOR ELECTRONICS III AND ELECTROCERAMICS IN JAPAN XII | 2010年 / 421-422卷

关键词：

Electrode; Silver; Paste; Sintering; Substrate;

D O I：

10.4028/www.scientific.net/KEM.421-422.289

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Several types of Ag powder were used as electrode paste for a multilayer ceramic substrate. The shrinkage behavior of the silver powders was investigated during the sintering. Bending and cracking were frequently observed on the substrate when coarse powders that show a broad size distribution and aggregation were used. The shrinkage curve of the Ag paste obtained by spray pyrolysis agreed well with that of the substrate. Furthermore, the electrical properties of the Ag paste were also determined. The resistivity of a silver electrode sintered at 900 degrees C was about 2.00x10(-6) Omega.cm.

引用

页码：289 / +

页数：2

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