共 70 条
[1]
Alizadeh R., 2020, Journal of Microelectronics and Electronic Packaging, V17, P67
[2]
Alizadeh R., 2019, P IEEE APPL POW EL C P IEEE APPL POW EL C
[3]
Alizadeh R, 2018, IEEE ENER CONV, P4810, DOI 10.1109/ECCE.2018.8558380
[4]
[Anonymous], 2017, DES CAS STUD DOUBL S DES CAS STUD DOUBL S
[5]
Anwar M, 2015, IEEE ENER CONV, P6006, DOI 10.1109/ECCE.2015.7310502
[6]
An BN, 2018, 2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), P375, DOI 10.23919/ICEP.2018.8374327
[7]
Barlow F.D., 2006, High-Temperature High-Power Packaging Techniques for HEV Traction Applications
[8]
Borghoff G, 2013, P INT EXH C POW EL A P INT EXH C POW EL A, P1
[9]
Boteler L.M., 2017, 2017 IEEE INT WORKSH, P1, DOI [10.1109/IWIPP.2017.7936764, DOI 10.1109/IWIPP.2017.7936764]
[10]
Burns R. C, 2016, P POW CONV INT MOT N P POW CONV INT MOT N, P969