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- [21] A Novel Approach to Assess Board Level Solder Joint Reliability for Flip-Chip on Leadframe Package Using Finite Element Analysis PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 229 - 233
- [22] PBGA Package Finite Element Analysis Based on the Physical Geometry Modeling using X-ray Micro CT Digital Volume Reconstruction 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 285 - 294
- [23] Springback prediction of high-strength steels in large radius air bending using finite element modeling approach 11TH INTERNATIONAL CONFERENCE ON TECHNOLOGY OF PLASTICITY, ICTP 2014, 2014, 81 : 1005 - 1010
- [26] Interior three-dimensional acoustic modeling and modal analysis using wavelet-based finite-element approach JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 2024, 156 (02): : 1252 - 1268
- [27] Modeling Three-dimensional Ultrasonic Guided Wave Propagation and Scattering in Circular Cylindrical Structures using Finite Element Approach 2011 INTERNATIONAL CONFERENCE ON PHYSICS SCIENCE AND TECHNOLOGY (ICPST), 2011, 22 : 112 - 118