3-D Chips! Chips are Getting Denser and Taller Than Ever!!

被引：0
作者：
John, Lizy Kurian [1 ]
机构：
[1] Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78712 USA
来源：
IEEE MICRO | 2019年 / 39卷 / 06期
关键词：
D O I：
10.1109/MM.2019.2948453
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：4 / 5
页数：2
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