Nanometric cutting: Mechanisms, practices and future perspectives

被引:75
作者
Fang, Fengzhou [1 ,2 ]
Lai, Min [1 ]
Wang, Jinshi [1 ]
Luo, Xichun [3 ]
Yan, Jiwang [4 ]
Yan, Yongda [5 ]
机构
[1] Tianjin Univ, State Key Lab Precis Measuring Technol & Instrumen, Lab Micro Nano Mfg Technol MNMT, Tianjin 300072, Peoples R China
[2] Univ Coll Dublin, Ctr Micro Nano Mfg Technol MNMT Dublin, Dublin, Ireland
[3] Univ Strathclyde, Ctr Precis Mfg, DMEM, Glasgow G1 1XJ, Scotland
[4] Keio Univ, Fac Sci & Technol, Dept Mech Engn, KohokuKu, Tokyo 2238522, Japan
[5] Harbin Inst Technol, Minist Educ, Ctr Precis Engn, Key Lab Microsyst & Microstruct Mfg, Harbin 150001, Heilongjiang, Peoples R China
基金
英国工程与自然科学研究理事会; 爱尔兰科学基金会;
关键词
Nanometric cutting; Material removal; Material deformation; Machinability; Atomic and close-to-atomic-scale; manufacturing; MOLECULAR-DYNAMICS SIMULATION; SINGLE-CRYSTAL SILICON; BRITTLE-DUCTILE TRANSITION; CONTROL SCULPTURING METHOD; REGIME MACHINING MODEL; DIAMOND TOOL WEAR; MATERIAL REMOVAL; DEFORMATION MECHANISM; MULTISCALE SIMULATION; ULTRASONIC VIBRATION;
D O I
10.1016/j.ijmachtools.2022.103905
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Nanometric cutting removes material at nanoscale and generates high-quality surfaces with a nanometric finish. In past decades, it has thrived as a mainstream manufacturing technology to produce critical components to advance scientific discovery and promote innovation in various fields, such as astronomy, aerospace, microelectronics, optics and photonics, biology and quantum technology. Therefore, it is timely to develop a review article capturing such developments and establishing directions for future advancement. This article systematically reviews the fundamental issues such as cutting model, material deformation mechanism and tool wear in nanometric cutting. It also presents the working principles of innovative ion implantation-assisted, laser-assisted and ultrasonic vibration-assisted nanometric cutting methods to overcome the challenges of machining difficult to-cut materials. Practical techniques for the generation of high-quality complex or structured surfaces are also discussed. Finally, challenges and future perspectives of nanometric cutting, as well as the evolution towards atomic and close-to-atomic scale manufacturing, are outlined.
引用
收藏
页数:32
相关论文
共 273 条
[1]   Observed edge radius behavior during MD nanomachining of silicon at a high uncut chip thickness [J].
Abdulkadir, Lukman N. ;
Abou-El-Hossein, Khaled .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 101 (5-8) :1741-1757
[2]   Influence of the Rake Angle on Nanocutting of Fe Single Crystals: A Molecular-Dynamics Study [J].
Alhafez, Iyad Alabd ;
Urbassek, Herbert M. .
CRYSTALS, 2020, 10 (06) :1-15
[3]   Orientation dependence in nanocutting of Fe single crystals: A molecular-dynamics study [J].
Alhafez, Iyad Alabd ;
Urbassek, Herbert M. .
COMPUTATIONAL MATERIALS SCIENCE, 2018, 143 :286-294
[4]   A predictive model of the critical undeformed chip thickness for ductile-brittle transition in nano-machining of brittle materials [J].
Arif, Muhammad ;
Zhang Xinquan ;
Rahman, Mustafizur ;
Kumar, Senthil .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2013, 64 :114-122
[5]   Applicability of cutting theory to nanocutting of metallic glasses: Atomistic simulation [J].
Avila, Karina E. ;
Vardanyan, Vardan Hoviki ;
Alhafez, Iyad Alabd ;
Zimmermann, Marco ;
Kirsch, Benjamin ;
Urbassek, Herbert M. .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2020, 550
[6]  
Bakshi V., 2018, EUV Lithography, V2
[7]  
Belak J., 1990, MOL DYNAMICS MODEL O
[8]   Ductile-regime grinding. A new technology for machining brittle materials [J].
Bifano, T.G. ;
Dow, T.A. ;
Scattergood, R.O. .
Journal of engineering for industry, 1991, 113 (02) :184-189
[9]   Ultrahigh-density atomic force microscopy data storage with erase capability [J].
Binnig, G ;
Despont, M ;
Drechsler, U ;
Häberle, W ;
Lutwyche, M ;
Vettiger, P ;
Mamin, HJ ;
Chui, BW ;
Kenny, TW .
APPLIED PHYSICS LETTERS, 1999, 74 (09) :1329-1331
[10]   MEASUREMENT OF SUBSURFACE DAMAGE IN SILICON-WAFERS [J].
BISMAYER, U ;
BRINKSMEIER, E ;
GUTTLER, B ;
SEIBT, H ;
MENZ, C .
PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1994, 16 (02) :139-144