An application of AHP and sensitivity analysis for selecting the best slicing machine

被引：181
作者：
Chang, Che-Wei
Wu, Cheng-Ru
Lin, Chin-Tsai
Chen, Huang-Chu
机构：
[1] Yuanpei Univ, Dept Informat Management, Hsinchu 30015, Taiwan
[2] Yuanpei Univ, Dept Finance, Hsinchu 30015, Taiwan
[3] Yuanpei Univ, Grad Inst Business & Management, Hsinchu 30015, Taiwan
来源：
COMPUTERS & INDUSTRIAL ENGINEERING | 2007年 / 52卷 / 02期
关键词：
silicon wafer slicing; Analytical Hierarchy Process; EWMA; sensitivity analysis;
D O I：
10.1016/j.cie.2006.11.006
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
Wafer slicing is a complex manufacturing process, complicating efforts to monitor process stability and quality control effectively. This study discusses and develops a manufacturing quality yield model for forecasting 12 in. silicon wafer slicing based on the Analytic Hierarchy Process (AHP) framework. Decision Makers can select evaluation outcomes to identify the most precise machine. Additionally, EWMA control chart is presented to demonstrate and verify the feasibility and effectiveness of the proposed AHP-based algorithm. Finally, sensitivity analysis is performed to test the stability of the priority ranking. Therefore, this work illustrates how the AHP model would be implemented to help engineers determine the manufacturing process yield quickly and effectively. (c) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码：296 / 307
页数：12
相关论文
共 19 条
[1]  
[Anonymous], 1995, ANN BOOK ASTM STANDA
[2]   Data mining for improving a cleaning process in the semiconductor industry [J].
Braha, D ;
Shmilovici, A .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2002, 15 (01) :91-101
[3]   SEMICONDUCTOR YIELD IMPROVEMENT - RESULTS AND BEST PRACTICES [J].
CUNNINGHAM, SP ;
SPANOS, CJ ;
VOROS, K .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1995, 8 (02) :103-109
[4]  
Delbecq AL., 1975, Group Techniques for Program Planning: A Guide to Nominal Group and Delphi Techniques
[5]  
HO CT, 2004, STRATEGIC EVALUATION, P251
[6]   Web-based multi-attribute analysis model for engineering project evaluation [J].
Hwang, HS .
COMPUTERS & INDUSTRIAL ENGINEERING, 2004, 46 (04) :669-678
[7]  
KAO I, 1997, NSF DES MAN GRANT C, P239
[8]   A simple approach to solving multi-response quality characteristic problems in CMOS ion implantation [J].
Lin, CT ;
Chang, CW ;
Chen, CB .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2006, 28 (5-6) :592-595
[9]   Relative control philosophy - balance and continual change for forecasting abnormal quality characteristics in a silicon wafer slicing process [J].
Lin, CT ;
Chang, CW ;
Chen, CB .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2005, 26 (9-10) :1109-1114
[10]  
LIN CT, 2004, INT J MANUFACTURING, V2, P171
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