Effect of the thermal constant on temperature rise of silver palladium alloy contacts

被引:10
作者
Miyanaga, Kazuaki
Kayano, Yoshiki
Inoue, Hiroshi
机构
关键词
electrical contact; silver palladium; temperature rise; FDTD; thermal constant;
D O I
10.1093/ietele/e90-c.7.1405
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a method of separating the effects of the thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of AgPd contacts was proposed. First, the effects of the Pd content on the durations and integral powers of the bridge and arc, and the temperature rise of the contacts were discussed. Because the integral power of bridge was larger than that of the arc under our experimental conditions of 40 V open-circuit, 5 A close-circuit and 100 mu m/s opening velocity, the temperature rise of the contacts was dominated by the bridge. No remarked difference in bridge duration can be seen among the six materials. Although the integral power of the bridge in the case of I'd was maximum, the maximum temperature rise of the contact was observed in the case of AgPd60. To clarify the contribution of each factor, the effect of thermal diffusivity on the temperature rise of the contact was evaluated by the finite-difference time-domain (FDTD) method. In the case of Pd, because its thermal diffusivity was largest, heat diffused rapidly. On the other hand, the thermal diffusivity in the case of AgPd60 was small, and heat diffused slowly to the holders. The maximum temperature rise was observed in the case of AgPd60. It was demonstrated that the proposed method of separating the effects of thermal diffusivity, durations and integral powers of the bridge and arc on the temperature rise of contacts is effective in enabling us to understand contact phenomena.
引用
收藏
页码:1405 / 1411
页数:7
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