Zn channeled implantation in GaN: damages investigated by using high resolution XTEM and channeling RBS

被引:10
作者
Ding, FR [1 ]
He, W
Vantomme, A
Zhao, Q
Pipeleers, B
Jacobs, K
Moerman, I
机构
[1] Beijing Univ, Dept Tech Phys, Beijing 100871, Peoples R China
[2] Katholieke Univ Leuven, Inst Kern & Stralingsfys, B-3001 Louvain, Belgium
[3] State Univ Ghent, IMEC, B-9000 Ghent, Belgium
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2003年 / 98卷 / 01期
基金
中国国家自然科学基金;
关键词
GaN; Zn; channeled implantation; XTEM; broken crystal;
D O I
10.1016/S0921-5107(02)00600-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Zn (140 keV) channeled (along [0001]) implantations in GaN are performed at room temperature and in a dose range from 1 x 10(13) to 4 x 10(16) Cm-2, respectively. Channeling RBS measurements and the high-resolution XTEM investigations show the two damage regimes after implantation: one at the surface and another in the projected range. The damage level is very small at low doses and then gradually rises with increasing dose. The backscattering yield from the near surface region reaches the random level at doses higher than 2 x 10(16) cm(-2) and the broken crystals and the amorphous in nanometer size are formed in the top thin surface layer after implantation at a dose of 3 x 10(16) Cm-2. In the followed defective crystalline layer, the density of defects decreases with increasing the depth. The thread defects and loops are dominant in the region close to the surface at high dose and the clustered point defects are dominant in the deeper layer. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:70 / 73
页数:4
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