Investigation on microstructure and mechanical properties of diffusion bonded Al/Mg2Si metal matrix composite using copper interlayer

被引：27
|
作者：
Nami, H. [1 ]
Halvaee, A. [1 ]
Adgi, H. [1 ]
Hadian, A. [1 ]
机构：
[1] Univ Tehran, Sch Met & Mat Engn, Fac Engn, Tehran, Iran
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2010年 / 210卷 / 10期
关键词：
Diffusion bonding; Mechanical properties; Microstructure; Copper interlayer; TITANIUM;
D O I：
10.1016/j.jmatprotec.2010.03.015
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Diffusion bonding of Al/Mg2Si metal matrix composite (MMC) using Cu interlayer at optimal bonding temperature of 5405 degrees C for various bonding durations was investigated This metal matrix composite (MMC) containing 15% Mg2Si particles was produced by in situ technique Specific diffusion bonding process was introduced as a low vacuum technique The composition and microstructure of the joined areas were examined by X-ray diffraction (XRD) and scanning electron microscopy equipped with energy dispersive X-ray spectroscopy (EDS) Microhardness and shear tests were conducted to the samples to evaluate the effect of bonding duration on weldability Several different diffusion layers exist at the bond region depending on the bonding duration The shear strength of Joints increased with bonding duration due to elimination of CuAl2 brittle diffusion layer (C) 2010 Elsevier B V All rights reserved
引用
收藏
页码：1282 / 1289
页数：8
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