Characterisation of polyamide 11/copper antimicrobial composites for medical device applications

被引:26
作者
Thokala, Nikhil [1 ]
Kealey, Carmel [2 ]
Kennedy, James [3 ]
Brady, Damien B. [2 ]
Farrell, Joseph B. [1 ]
机构
[1] Dept Mech & Polymer Engn, Dublin, Ireland
[2] Dept Life & Phys Sci, Dublin, Ireland
[3] Grangegorman, Kastus, Dublin 7, Ireland
来源
MATERIALS SCIENCE & ENGINEERING C-MATERIALS FOR BIOLOGICAL APPLICATIONS | 2017年 / 78卷
关键词
Device related infections; Antimicrobial polymers; Inorganic antimicrobial additives; Antimicrobial efficacy; Polymer morphology; Ion release; ISOTHERMAL CRYSTALLIZATION; URINARY; CATHETERS; BEHAVIOR; NANOPARTICLES; INFECTIONS; POLYMERS; ZEOLITE; METAL;
D O I
10.1016/j.msec.2017.03.149
中图分类号
TB3 [工程材料学]; R318.08 [生物材料学];
学科分类号
0805 ; 080501 ; 080502 ;
摘要
Direct incorporation of antimicrobial additive into the polymer matrix is a cost effective approach for the development of polymer/metal antimicrobial composites. Application of these antimicrobial composite systems for manufacturing medical devices addresses the issue of device related infections. In the present study, commercially available inorganic copper based additive, Plasticopper, was incorporated into a Polyamide 11(PA 11) matrix during the polymer processing stage. These polymer composites were evaluated for their morphological, mechanical, antimicrobial and ion release properties. Isothermal crystallisation studies showed that the copper additive acted as a nucleating agent and promoted faster crystallisation. Short term mechanical studies confirmed that the incorporation of copper has reinforcing effect on the composites with 5 and 10% copper loadings and did not adversely affect the short-term mechanical performance of the polymer composites. These composite systems were shown to be active against Escherichia coli ATCC 8739 with >99.99% reduction in bacterial population. Corresponding ion release profiles for these composites indicated long term antimicrobial activity. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:1179 / 1186
页数:8
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