The Parameters Determination of Path Loss Model for THz Chip-to-Chip Wireless Communications

被引：0
|
作者：
Fu, Jinbang [1 ]
Juyal, Prateek [1 ]
Yilmaz, Baki Berkay [1 ]
Zajic, Alenka [1 ]
机构：
[1] Georgia Inst Technol, Atlanta, GA 30332 USA
来源：
2020 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND NORTH AMERICAN RADIO SCIENCE MEETING | 2020年
关键词：
D O I：
10.1109/IEEECONF35879.2020.9329540
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the parameters determination of a path loss model for THz chip-to-chip wireless communication in desktop size metal enclosures. To determine the parameters, gradient decent algorithm was applied to minimize the mean square error between the model and the experimental results. Measurements were performed and the obtained results match well with the model prediction.
引用
收藏
页码：1167 / 1168
页数：2
相关论文
共 50 条
  • [1] Investigation of Resonance Based Propagation Loss Modeling for THz Chip-to-Chip Wireless Communications
    Fu, Jinbang
    Juyal, Prateek
    Yilmaz, Bald Berkay
    Zajic, Alenka
    2020 14TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP 2020), 2020,
  • [2] Path Loss Model as a Function of Antenna Height for 300 GHz Chip-to-Chip Communications
    Fu, Jinbang
    Juyal, Prateek
    Zajid, Alenka G.
    2019 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND USNC-URSI RADIO SCIENCE MEETING, 2019, : 1275 - 1276
  • [3] Sub-THz Interconnect for Planar Chip-to-Chip Communications
    Yu, Bo
    Ye, Yu
    Ding, Xuan
    Neher, Christian
    Liu, Xiaoguang
    Xu, Zhiwei
    Gu, Qun Jane
    2018 IEEE 18TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2018, : 54 - 56
  • [4] Ultrawideband design challenges for wireless chip-to-chip communications and interconnects
    Celebi, Hasari
    Ahin, Mustafa E.
    Arslan, Huseyin
    Haque, Jamal
    Prado, Edward R.
    Markell, David P.
    2006 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2006, : 2408 - +
  • [5] Optical Interconnects for Chip-to-Chip Communications
    Fields, Mitchell
    2010 36TH EUROPEAN CONFERENCE AND EXHIBITION ON OPTICAL COMMUNICATION (ECOC), VOLS 1 AND 2, 2010,
  • [6] Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications
    Yu, Bo
    Ye, Yu
    Ding, Xuan
    Liu, Yuhao
    Xu, Zhiwei
    Liu, Xiaoguang
    Gu, Qun Jane
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2018, 66 (04) : 1864 - 1873
  • [7] Square dielectric interconnect for chip-to-chip THz communication
    Aflakian, N.
    LaFave, T., Jr.
    Henderson, R. M.
    O, K. K.
    MacFarlane, D. L.
    PROCEEDINGS OF THE 2017 TEXAS SYMPOSIUM ON WIRELESS AND MICROWAVE CIRCUITS AND SYSTEMS (WMCS), 2017,
  • [8] Chip-to-chip communications using capacitive interconnects
    Viitala, Olli
    Ryynanen, Jussi
    2010 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, 2010, : 2888 - 2891
  • [9] Towards Dielectric Chip-to-Chip Interconnects for THz Applications
    Bader, Tobias
    Gold, Gerald
    2024 IEEE WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE, WAMICON, 2024,
  • [10] An Omnidirectional Antenna-in-Package based on FOWLP for THz Chip-to-Chip Wireless Interconnect Applications
    Zhuang, Gang
    Wu, Ya Fei
    Chai, Yang
    Cheng, Yu Jian
    2024 15TH GLOBAL SYMPOSIUM ON MILLIMETER-WAVES & TERAHERTZ, GSMM, 2024, : 116 - 118
12345