THERMAL STRENGTH OF ADHESION BOND

被引：6
|
作者：
Andreev, V., I [1 ]
Turusov, R. A. [1 ]
机构：
[1] Moscow State Univ Civil Engn, Moscow 129337, Russia
来源：
APPLIED MECHANICS, MATERIALS AND MANUFACTURING IV | 2014年 / 670-671卷
关键词：
composite; glue; adhesion; thermal strength; elasticity; contact layer; shear stresses;
D O I：
10.4028/www.scientific.net/AMM.670-671.153
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The article considers the one-dimensional problem of the destruction of the simplest model of adhesively engage consisting generally of the many plates, which are substrates (what are glued) and adhesives (glues). The ability of the model to resist to thermal impact without fracturing here conventionally called the thermal strength. The problem is solved in the elastic formulation.
引用
收藏
页码：153 / 157
页数：5
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