Computational Modelling-Based Device Design for Improved mmWave Performance and Linearity of GaN HEMTs

被引:11
作者
Soni, Ankit [1 ]
Shrivastava, Mayank [1 ]
机构
[1] Indian Inst Sci, Dept Elect Syst Engn, Adv Nanoelect Device & Circuit Res Lab, Bengaluru 560012, Karnataka, India
关键词
AlGaN; GaN; AlN; TCAD; HEMT; device simulation; RF HEMT; device design; non-linearity; BREAKDOWN VOLTAGE; ENHANCEMENT; TRANSISTORS; RESISTANCE; MOBILITY; CHARGE; F(T);
D O I
10.1109/JEDS.2019.2958915
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, a comprehensive, TCAD based design approach for mmWave (mmW) GaN HEMTs is presented. Unique trade-offs between epi-layer design and HEMT's mmW performance are discussed. Effect of surface states on cut off frequency is modeled and presented. We have found that carrier trapping by the donor type interface states causes RF performance drift at high drain fields, which particularly leads to the non-linear behavior of mmW HEMTs at high drain bias. Moreover, we have observed that channel electrostatics, barrier layer, and UID GaN channel design govern the linearity and scaling behavior of such GaN HEMTs. To improve channel electrostatics, which improves the linearity and cut-off frequency, a partially recessed barrier under the gate is studied. A relative study of AlN/GaN HEMT and AlGaN/GaN HEMTs is performed to investigate the nonlinearity behavior. In addition, the dependence of cut-off frequency on contact resistance and lateral scaling is studied for partially-recessed barrier and conventional design for both AlN and AlGaN barrier types. The mmW performance is found to be a strong function of barrier design in the gate and recess regions. Unique design trends and physical behavior was observed for AlN and AlGaN barriers, which signifies that design guidelines derived for one epi-stack can't be deployed to the other.
引用
收藏
页码:33 / 41
页数:9
相关论文
共 23 条
[1]  
[Anonymous], P IEEE IMS JUN
[2]   Punchthrough-Voltage Enhancement of AlGaN/GaN HEMTs Using AlGaN Double-Heterojunction Confinement [J].
Bahat-Treidel, Eldad ;
Hilt, Oliver ;
Brunner, Frank ;
Wuerfl, Joachim ;
Traenkle, Guenther .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (12) :3354-3359
[3]   AlGaN/GaN HEMT With 300-GHz fmax [J].
Chung, Jinwook W. ;
Hoke, William E. ;
Chumbes, Eduardo M. ;
Palacios, Tomas .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (03) :195-197
[4]   IONIZATION RATES FOR ELECTRONS AND HOLES IN SILICON [J].
CHYNOWETH, AG .
PHYSICAL REVIEW, 1958, 109 (05) :1537-1540
[5]   Part II: Proposals to Independently Engineer Donor and Acceptor Trap Concentrations in GaN Buffer for Ultrahigh Breakdown AlGaN/GaN HEMTs [J].
Joshi, Vipin ;
Tiwari, Prakash ;
Shrivastava, Mayank .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) :570-577
[6]   Part I: Physical Insight Into Carbon-Doping-Induced Delayed Avalanche Action in GaN Buffer in AlGaN/GaN HEMTs [J].
Joshi, Vipin ;
Tiwari, Prakash ;
Shrivastava, Mayank .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) :561-569
[7]   A Comprehensive Computational Modeling Approach for AlGaN/GaN HEMTs [J].
Joshi, Vipin ;
Soni, Ankit ;
Tiwari, Shree Prakash ;
Shrivastava, Mayank .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2016, 15 (06) :947-955
[8]   Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate [J].
Karmalkar, S ;
Mishra, UK .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (08) :1515-1521
[9]   Device Delay in GaN Transistors Under High Drain Bias Conditions [J].
Lee, Dong Seup ;
Laboutin, Oleg ;
Cao, Yu ;
Johnson, Jerry Wayne ;
Beam, Edward ;
Ketterson, Andrew ;
Schuette, Michael L. ;
Saunier, Paul ;
Palacios, Tomas .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (07) :849-851
[10]   MODELING OF CARRIER MOBILITY AGAINST CARRIER CONCENTRATION IN ARSENIC-DOPED, PHOSPHORUS-DOPED, AND BORON-DOPED SILICON [J].
MASETTI, G ;
SEVERI, M ;
SOLMI, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (07) :764-769