An integrated micro-optical system for VCSEL-to-fiber active alignment

被引:26
作者
Ishikawa, K [1 ]
Zhang, JL [1 ]
Tuantranont, A [1 ]
Bright, VM [1 ]
Lee, YC [1 ]
机构
[1] Univ Colorado, NSF, Ctr Adv Mfg & Packaging Microwave Opt & Digital E, Boulder, CO 80309 USA
关键词
MEMS; micromirror; VCSEL; optical fiber; coupling efficiency; alignment;
D O I
10.1016/S0924-4247(02)00313-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a new micro-optical system for VCSEL-to-fiber active alignment is described. An integrated microsystem platform, which has a thermally-actuated micromirror, a silicon etched v-groove and flip-chip function, is successfully fabricated and actuated for beam adjustment from a vertical-cavity surface-emitting laser (VCSEL) to a fiber. The micro-optical system has 4.0degrees maximum beam steering angle with the resolution of 0.08degrees/mA. With the steering angle reaching 2.5degrees, the coupling. efficiency from the VCSEL to the fiber improves to more than 80% from 9% initial efficiency of 25 mum misaligned fiber position. (C) 2003 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:109 / 115
页数:7
相关论文
共 10 条
[1]  
AHLFELDT H, 1997, P INT C OPT MEMS THE, P155
[2]  
BUCKMAN L, 1998, P HOT INT STANF CA, V6, P137
[3]   PACKAGING OF HIGH-DENSITY FIBER LASER MODULES USING PASSIVE ALIGNMENT TECHNIQUES [J].
COHEN, MS ;
CINA, MF ;
BASSOUS, E ;
OPYRSKO, MM ;
SPEIDELL, JL ;
CANORA, FJ ;
DEFRANZA, MJ .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (06) :944-955
[4]   Laser-to-fiber coupling module using a micromachined alignment mirror [J].
Daneman, MJ ;
Solgaard, O ;
Tien, NC ;
Lau, KY ;
Muller, RS .
IEEE PHOTONICS TECHNOLOGY LETTERS, 1996, 8 (03) :396-398
[5]   The realization and design considerations of a flip-chip integrated MEMS tunable capacitor [J].
Harsh, KF ;
Su, BZ ;
Zhang, WG ;
Bright, VM ;
Lee, YC .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 80 (02) :108-118
[6]   Solder self-assembly for three-dimensional microelectromechanical systems [J].
Harsh, KF ;
Bright, VM ;
Lee, YC .
SENSORS AND ACTUATORS A-PHYSICAL, 1999, 77 (03) :237-244
[7]  
KARSTENSEN H, 1995, P IEEE LEOS, P226
[8]  
KOESTER DA, 2002, MUMPS DESIGN HDB
[9]   Lens-coupled laser diode module integrated on silicon platform [J].
Nakagawa, G ;
Miura, K ;
Sasaki, S ;
Yano, M .
JOURNAL OF LIGHTWAVE TECHNOLOGY, 1996, 14 (06) :1519-1523
[10]   OPTOELECTRONIC PACKAGING USING SILICON SURFACE-MICROMACHINED ALIGNMENT MIRRORS [J].
SOLGAARD, O ;
DANEMAN, M ;
TIEN, NC ;
FRIEDBERGER, A ;
MULLER, RS ;
LAU, KY .
IEEE PHOTONICS TECHNOLOGY LETTERS, 1995, 7 (01) :41-43