Cold drawing and annealing behavior of nano-sized Al2O3 dispersion strengthened copper

Mechanical, electrical properties measurements and microstructures observation on cold drawn and annealed Cu-Al2O3 alloy are conducted. The results show: with the increasing of cold drawing reduction, sigma(b) and sigma(0.2) increase and sigma decreases while electrical conductivity fall slightly. For the alloy with cold drawn in 92% reduction, sigma(b), sigma(0.2), sigma and electrical conductivity reach 490 MPa, 485 MPa, 10% and 91.4%IACS respectively and recover to some extent after annealed at 400degreesC similar to 1050degreesC for 1h. After annealed at 900degreesC for 1 h the properties of alloy with diffrernt amounts of deformation recover to that of as-extruded and there exist no recrystallization in microstructure. Cold drawing can further promote the metallurgically bonding among the powders granules.