Usage of Low-Temperature Co-Fired Ceramic in Hermetic Packaging

被引：0

作者：

Klima, Martin ^{[1
]}

Somer, Jakub ^{[1
]}

Blahova, Lucie ^{[2
]}

Prochazka, Michal ^{[2
]}

Szendiuch, Ivan ^{[1
]}

机构：

[1] Brno Univ Technol, Dept Microelect, CS-61090 Brno, Czech Republic

[2] Brno Univ Technol, Inst Phys & Appl Chem, CS-61090 Brno, Czech Republic

来源：

PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

引用

页码：99 / 103

页数：5

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