Usage of Low-Temperature Co-Fired Ceramic in Hermetic Packaging

被引：0
|
作者：
Klima, Martin [1 ]
Somer, Jakub [1 ]
Blahova, Lucie [2 ]
Prochazka, Michal [2 ]
Szendiuch, Ivan [1 ]
机构：
[1] Brno Univ Technol, Dept Microelect, CS-61090 Brno, Czech Republic
[2] Brno Univ Technol, Inst Phys & Appl Chem, CS-61090 Brno, Czech Republic
来源：
PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION | 2014年
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D O I：
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.
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页码：99 / 103
页数：5
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