Investigation of hot carrier effects in n-MOSFETs thick oxide with HfSiON and SiON gate dielectrics

被引:4
作者
Nam, K. J.
Lee, S. H.
Kim, D. C.
Hyun, S.
Kim, J. H.
Jeon, I. S.
Kang, S. B.
Choi, S.
机构
来源
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL | 2007年
关键词
D O I
10.1109/RELPHY.2007.369981
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper reports the reliability characteristics of poly gated n-MOSFETs with HfSiON and SiON gate dielectrics in both thin and thick oxide of dual gate oxide scheme. Hot carrier stress(HCS) at Isub,max condition on thick oxide is found to be the most critical part among the various reliability concerns. Regardless of gate dielectric and gate oxide thickness, the degradation behavior of the condition of Isub,max and Vg=Vd HCS is mainly SS increase and Vth shift, respectively. Therefore, for precise evaluation of the device reliability, it is necessary that HC immunity at Isub,max stress should be checked in thick oxide transistor below 50 nm design rule era.
引用
收藏
页码:622 / 623
页数:2
相关论文
共 6 条
[1]   Hot carrier degradation on n-channel HfSiON MOSFETs: Effects on the device performance and lifetime [J].
Cimino, S ;
Pantisan, L ;
Aoulaiche, M ;
Degraeve, R ;
Kwak, H ;
Crupi, F ;
Groeseneken, G ;
Paccagnella, A .
2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, :275-279
[2]   PBTI & HCI characteristics for high-k gate dielectrics with poly-Si & MIPS (Metal inserted poly-Si stack) gates [J].
Jung, HS ;
Han, SK ;
Kim, MJ ;
Kim, JP ;
Kim, YS ;
Lim, HJ ;
Doh, SJ ;
Lee, JH ;
Yu, MY ;
Lee, JH ;
Lee, NI ;
Kang, HK ;
Park, SG ;
Kang, SB .
2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, :50-54
[3]  
SCHRODER DK, 2003, APPL PHYS P1
[4]  
SIM JH, 2005, IRPS, P177
[5]  
TAKAYANAGI M, 2004, IRPS, P13
[6]  
ITRS ROADMAP 2005 ED